Crystal Machining

We can assume service and research orders for industry, universities and other research institutions, ranging from the fabrication of machined samples to the development of technologies and related documentations. Special demands on geometry and surface quality of various samples can be fulfilled in short time and with high quality. In cooperation with the characterization group we ensure a high quality standard.

Our portfolio includes the following services:

  • Crystal orientation using x-ray techniques
  • Crystal cutting and wafering by different methods - single and multi-diamond wire and inner diameter diamond sawing
  • Wafer grinding with diamond tools
  • Wafer lapping and polishing with various abrasives (aluminum oxide, cerium oxide, silicon carbide, boron carbide, diamond) in different particle sizes and suspensions
  • Mechanical and chemo-mechanical polishing with high precision polishing machines
  • Surface characterization by light microscopy, confocal microscopy (CFM), atomic force microscopy (AFM), scanning electron microscopy (REM) and x-ray techniques


For further information or inquiries please contact us.

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