Special Equipment

Special Equipment & Methods

In addition to standardized laboratory equipment, the IKZ owns a range of special equipment and devices for the growth and characterization of crystalline materials.

  • (Bridgman) / Vertical gradient freeze (VGF) - equipped with KristMAG® heater magnet modules
  • Czochralski growth - partly equipped with KristMAG® heater magnet modules
  • Edge-defined film-fed growth
  • Floating-Zone (FZ)
  • Flux and top seeded solution growth (TSSG) process
  • Levitation-assisted self-seeding crystal growth method
  • Micro pulling down
  • Pedestal growth
  • Physical vapor transport (PVT)

  • Liquid phase epitaxy (TDM, LPE)
  • Metalorganic chemical vapor deposition (liquid-delivery spin MOCVD)
  • Molecular beam epitaxy with solid sources (MBE) and gas sources (GSMBE)
  • Physical vapor deposition (PVD)
  • Pulsed laser deposition (PLD)
  • Vapour liquid solid (VLS)

Microscopy

  • Atomic force microscopy (AFM) – incl. piezoresponce force microscopy (PFM)
  • Confocal microscopy
  • Light microscopy
  • Scanning electron microscopy (with focused ion beam)
  • Transmission electron microscopy (TEM/STEM)

 

Optics and Spectroscopy

  • EPR spectrometer with LHe-flow cryostat
  • ICP OES spectrometer
  • Laser scattering tomography
  • Micro-Raman spectrometer (325, 442, 488, 514, 633, 785 nm)
  • Optical cryostats
  • Optical transmission measuring station (254 nm)
  • Spectroscopic ellipsometry
  • UV-VIS-NIR spectrometer (180-3300 nm)
  • Vakuum FTIR spectrometer (8000-10 cm-1)
  • Vakuum UV spectrometer (115-230 nm)

 

X-ray characterization

  • Energy-dispersive x-ray diffractometer
  • (High-resolution) x-ray diffractometer (with heating stage up to 1600 °C)
  • Laue-system for crystal orientation
  • Micro x-ray fluorescence analysis (µ-RFA)
  • X-ray projection topography with rotary anode

 

Electrical Measurements

  • Capacitance-voltage (C-V) and current-voltage (I-V) profiling
  • Deep-level transient spectroscopy (DLTS) system
  • Hall-effect measurement system with cooling and heating unit (15 – 800 K)
  • Lateral photovoltage scanning (LPS) and photoluminescence (PL)

 

Other

  • BET-system for internal surfaces measurements
  • Differential thermal analysis (DTA) (up to 2400 °C)
  • Ferroelectric tester with laser beam interferometer
  • Image processing device
  • Interferometer probe
  • Laser flash apparatur / pyrometer version for up to 2800 °C
  • MDPmap (mono- and multi-crystalline wafer lifetime measurement device)
  • Simultaneous thermal analysis (STA) equipment
  • Substrate preparation (thermal, chemical)
  • Surface profilometer (Dektak)

  • Diamond wire sawing (single and multi)
  • Inner diameter saw
  • Measuring instruments for surface topography and geometry analysis
    (MicroProof 300 from FRT, Quick Vision ELF from Mitutoyo)
  • Precision lapping and polishing machines for wafer sizes up to 6"
  • Precision surface grinder

Dr. Maike Schröder
Tel.: +49 30 6392 3008
E-Mail