Special Equipment & Methods

• (Bridgman) / Vertical gradient freeze (VGF) - equipped with KristMAG^® heater magnet modules
• Czochralski growth - partly equipped with KristMAG^® heater magnet modules
• Edge-defined film-fed growth
• Floating-Zone (FZ)
• Flux and top seeded solution growth (TSSG) process
• Levitation-assisted self-seeding crystal growth method
• Micro pulling down
• Pedestal growth
• Physical vapor transport (PVT)

• Liquid phase epitaxy (TDM, LPE)
• Metalorganic chemical vapor deposition (liquid-delivery spin MOCVD)
• Molecular beam epitaxy with solid sources (MBE) and gas sources (GSMBE)
• Physical vapor deposition (PVD)
• Pulsed laser deposition (PLD)
• Vapour liquid solid (VLS)

Microscopy

• Atomic force microscopy (AFM) – incl. piezoresponce force microscopy (PFM)
• Confocal microscopy
• Light microscopy
• Scanning electron microscopy (with focused ion beam)
• Transmission electron microscopy (TEM/STEM)

Optics and Spectroscopy

• EPR spectrometer with LHe-flow cryostat
• ICP OES spectrometer
• Laser scattering tomography
• Micro-Raman spectrometer (325, 442, 488, 514, 633, 785 nm)
• Optical cryostats
• Optical transmission measuring station (254 nm)
• Spectroscopic ellipsometry
• UV-VIS-NIR spectrometer (180-3300 nm)
• Vakuum FTIR spectrometer (8000-10 cm^-1)
• Vakuum UV spectrometer (115-230 nm)

X-ray characterization

• Energy-dispersive x-ray diffractometer
• (High-resolution) x-ray diffractometer (with heating stage up to 1600 °C)
• Laue-system for crystal orientation
• Micro x-ray fluorescence analysis (µ-RFA)
• X-ray projection topography with rotary anode

Electrical Measurements

• Capacitance-voltage (C-V) and current-voltage (I-V) profiling
• Deep-level transient spectroscopy (DLTS) system
• Hall-effect measurement system with cooling and heating unit (15 – 800 K)
• Lateral photovoltage scanning (LPS) and photoluminescence (PL)

Other

• BET-system for internal surfaces measurements
• Differential thermal analysis (DTA) (up to 2400 °C)
• Ferroelectric tester with laser beam interferometer
• Image processing device
• Interferometer probe
• Laser flash apparatur / pyrometer version for up to 2800 °C
• MDPmap (mono- and multi-crystalline wafer lifetime measurement device)
• Simultaneous thermal analysis (STA) equipment
• Substrate preparation (thermal, chemical)
• Surface profilometer (Dektak)

• Diamond wire sawing (single and multi)
• Inner diameter saw
• Measuring instruments for surface topography and geometry analysis
  (MicroProof 300 from FRT, Quick Vision ELF from Mitutoyo)
• Precision lapping and polishing machines for wafer sizes up to 6"
• Precision surface grinder